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Electronics » Computers & Add-Ons » Computer Add-Ons » CPU Processors » Intel LGA 771


Processor - 1 x Intel Quad-Core Xeon E5430 / 2.66 GHz ( 1333 MHz ) - LGA771 Socket - L2 12 MB ( 2 x 6MB ) - Box



BX80574E5430P

IN STOCK
SKU: BX80574E5430P
UPC: 735858198882
Your Price: $521.22
Shipping $8.33
Ships in 1-2 business days

Product Description

Intel Boxed Processor, Quad-Core Xeon E5430 with Passive HeatSink, 2.66GHz, 12M Cache, 1333MHz FSB.

MODEL- BX80574E5430P VENDOR- INTEL CORP.

FEATURES- Quad-Core Intel Xeon Processor 5400 Series
2U Passive Heatsink, 45nm, 2.66 GHz (80W), 1333 MHz FSB, 12M Cache,
4 Cores, DBS, VT, FlexMigration.
Now featuring Intel's second-generation quad-core processor,
existing mainstream server platforms, new high-performance
computing (HPC) systems, new workstations, and new business servers
each deliver a unique combination of technology targeted at
specific IT use environments. By selecting a platform that is best
tuned for the most common IT usages, Intel servers are able to
better optimize return on investment while extending the leading
performance and performance-per-watt advantages enjoyed when using
Intel's proven multi-core technology. Quad-Core Intel Xeon
processor 5400 series help provide your data center or business
with the performance headroom needed to confidently consolidate
applications onto fewer systems using proven virtualization
solutions or the compute power necessary for high-performance
computing applications and workstation solutions.
The Quad-Core Intel Xeon Processor 5400 Series is compatible with
Intel 5400, 5100, 5000P, 5000V and 5000X series of chipsets. Server
boards based on these chipsets are optimized for quad core with
advanced platform features of Dual Independent Bus and Fully
Buffered DIMM memory technology offering up to 4X available
bandwidth of current generation platforms. Improved I/O performance
is possible with PCI Express and the option of Intel I/O
Acceleration Technology.

  • Multi-core processing
    - 45nm technology boosts performance on a range of workloads.
    - Increased headroom for multi-threaded applications and heavy multi-
    tasking scenarios.
    - Helps boost system utilization through virtualization and application
    responsiveness.
  • Enhanced Intel Core microarchitecture
    - Boosts performance on multiple applications, user environments and
    data-demanding workloads, while enabling denser data center
    deployments through improved performance per watt.
    - The 45nm Enhanced Intel Core microarchitecture delivers up to 38 more
    performance per watt in the same platforms and at the same system
    power level.
    - Reduced idle processor power lowers average server power consumption.
  • Large 12 MB of on-die L2 Cache (2 x 6 MB)
    - Increases efficiency of L2 Cache-to-core data transfers, maximizing
    main memory to processor bandwidth.
    - Reduces latency by storing larger data sets closer to the processor,
    reducing the number of trips to main memory.
    - Up to 6 MB of L2 Cache can be allocated to one core.
  • Intel Virtualization Technology (Intel VT)
    - A suite of processor enhancements that assists virtualization software
    to deliver more efficient virtualization solutions and greater
    capabilities including 64-bit guest OS support.
  • Intel I/O Acceleration Technology
    - Next-generation improvements designed to significantly accelerate data
    processing across the entire platform through CPU utilization and
    latency improvements.
  • Enhanced Front-Side Bus (FSB)
    - New dedicated high-speed bus design enables increased throughput and
    bandwidth between each of the processors and the chipset.
    - Supporting from 1066 up to 1333 or 1600 MHz.
  • Intel 64 Architecture
    - Flexibility for 64-bit and 32-bit applications and operating systems.

    -- SPECIFICATIONs -----------------------------------
    sSPEC# - SLANS
    CPU SPEED - 2.66 GHz
    BUS SPEED - 1333 MHz
    BUS/CORE RATIO - 8
    L2 CACHE SIZE - 12 MB
    L2 CACHE SPEED - 2.66 GHz
    PACKAGE TYPE - LGA771
    MFG. TECH - 45 nm
    STEPPING - C0
    CPUID STRING - 10676h
    THERMAL DESIGN POWER - 80W
    THERMAL SPECIFICATION- 67 degrees C
    VID VOLTAGE RANGE - 0.95V - 1.225V

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